The UHF RFID inlays material is Polyimide (PI). With their high heat-resistance, The inlay can be applied for high temperature environment. You can make the inlay to label or metal tag.we use better electrical conducting material, copper, and antenna, our UHF inlays deliver better RF performance and hence much stable performance.
D.O RFID Tag Manufacturer developed a new UHF RFID inlay products based on polyimide (PI) and copper (Cu) structure.
This new PI / Cu inlays exhibit excellent detection performance, high reliability, and superior stability characteristics. Because of the usage of PI and Cu as their core building materials and SMT manufacturing process, these inlays can endure harsh environmental variations but itcan not be done with typical PET / Aluminum inlays based on flipchip process.
As the result of secondary chip packaging, D.O RFD Tag Manufacturer’s inlays adopt most of the commercially available UHF chip technology, D.O RFD Tag Manufacturer’s PI / Cu UHF inlays have additional protection for inlay’s most critical component. A stronger and rigid connection between the UHF IC and the antenna is the direct benefit of the SMT process. Compared to traditional PET / Aluminum inlays based on flipchip process where the inlay’s UHF chip and the antenna is “glued” by “conductive gels”, and can suffer loss of adhesion due to moisture absorption under humid environment. However, SMT solder joints do not suffer from humidity caused connectivity degradation and can work with expected stable performance.
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